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Tiantian LiAssociate professor, Xi’an University of Posts & TelecommunicationsVerified email at xupt.edu.cn- Feifan WangPostdoc, Peking UniversityVerified email at pku.edu.cn
- James C. HoneDepartment of Mechanical Engineering, Columbia UniversityVerified email at columbia.edu
- Zi WangNISTVerified email at nist.gov
- Nicholas PetroneDepartment of Mechanical Engineering, Columbia UniversityVerified email at columbia.edu
- Yahui XiaoGlobalFoundries, University of DelawareVerified email at udel.edu
- Po DongII-VI Incorporated, Bell Labs, Fellow of IEEE, OSA and II-VIVerified email at ieee.org
- Qiu LiAssociate professor, Tianjin University of Technology and EducationVerified email at udel.edu
- Craig B. ArnoldSusan Dod Brown Professor of Mechanical and Aerospace Engineering, Princeton UniversityVerified email at princeton.edu
- Tony LowU of Minnesota, IBM Research, Columbia U, Purdue U, National U SingaporeVerified email at us.ibm.com
- Luke F. LesterRoanoke Electric Steel Professor EmeritusVerified email at vt.edu
- Jeffrey SinskyPrincipal R&D Engineer, Hardware , PsiQuantumVerified email at ieee.org
- Tony F HeinzDepts. of Applied Physics, Photon Science, and, by courtesy, of Electrical Eng., SLAC, StanfordVerified email at stanford.edu
- Xiaodong YangMissouri University of Science and TechnologyVerified email at mst.edu
- Serdar KocamanMETUVerified email at columbia.edu
- Young-Kai ChenII-VI Inc., Cornell University/Princeton UniversityVerified email at cornell.edu
- Rodney PriestleyVerified email at u.northwestern.edu
- Yongjun HuangFull Professor, University of Electronic Science and Technology of ChinaVerified email at uestc.edu.cn
- Andrei V. LavrinenkoAssociated Professor, Technical University of DenmarkVerified email at fotonik.dtu.dk
- Yufeng Hao (郝玉峰)Professor of Materials Science and Engineering, Nanjing UniversityVerified email at nju.edu.cn
