| Sn-3.0 Ag-0.5 Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology YA Shen, S Zhou, J Li, C Yang, S Huang, S Lin, H Nishikawa Materials & design 183, 108144, 2019 | 84 | 2019 |
| Improvement in the mechanical properties of eutectic Sn58Bi alloy by 0.5 and 1 wt% Zn addition before and after thermal aging S Zhou, O Mokhtari, MG Rafique, VC Shunmugasamy, B Mansoor, ... Journal of Alloys and Compounds 765, 1243-1252, 2018 | 82 | 2018 |
| Effects of Ti addition on the microstructure, mechanical properties and electrical resistivity of eutectic Sn58Bi alloy S Zhou, C Yang, S Lin, AN AlHazaa, O Mokhtari, X Liu, H Nishikawa Materials Science and Engineering: A 744, 560-569, 2019 | 57 | 2019 |
| Thermomigration induced microstructure and property changes in Sn-58Bi solders YA Shen, S Zhou, J Li, KN Tu, H Nishikawa Materials & Design 166, 107619, 2019 | 48 | 2019 |
| The newly developed Sn–Bi–Zn alloy with a low melting point, improved ductility, and high ultimate tensile strength S Zhou, C Yang, YA Shen, S Lin, H Nishikawa Materialia 6, 100300, 2019 | 43 | 2019 |
| The self-healing of Kirkendall voids on the interface between Sn and (1 1 1) oriented nanotwinned Cu under thermal aging S Zhou, YB Zhang, LY Gao, Z Li, ZQ Liu Applied Surface Science 588, 152900, 2022 | 26 | 2022 |
| Improved mechanical properties induced by In and In & Zn double additions to eutectic Sn58Bi alloy S Zhou, YA Shen, T Uresti, VC Shunmugasamy, B Mansoor, H Nishikawa Journal of Materials Science: Materials in Electronics 30, 7423-7434, 2019 | 24 | 2019 |
| Novel polarity effect on intermetallic compound thickness changes during electromigration in Cu/Sn-3.0 Ag-0.5 Cu/Cu solder joints Z Jin, YA Shen, S He, S Zhou, YC Chan, H Nishikawa Journal of Applied Physics 126 (18), 2019 | 21 | 2019 |
| A computational thermodynamics-assisted development of Sn-Bi-In-Ga quaternary alloys as low-temperature Pb-free solders C Yang, S Zhou, S Lin, H Nishikawa Materials 12 (4), 631, 2019 | 21 | 2019 |
| Effect of Zn addition on interfacial reactions between Sn-Bi solder and Cu substrate O Mokhtari, S Zhou, C YC, H Nishikawa Materials Transactions 57 (8), 1272-1276, 2016 | 18 | 2016 |
| Preferred orientation of Bi and effect of Sn-Bi microstructure on mechanical and thermomechanical properties in eutectic Sn-Bi alloy YA Shen, S Zhou, H Nishikawa Materialia 6, 100309, 2019 | 17 | 2019 |
| Thermal stability of low-temperature sintered joint using Sn-coated Cu particles during isothermal aging at 250° C X Liu, S Zhou, H Nishikawa Journal of Materials Science: Materials in Electronics 28, 12606-12616, 2017 | 11 | 2017 |
| Effect of Zn addition on interfacial reactions and mechanical properties between eutectic Sn58Bi solder and ENIG substrate S Zhou, S He, H Nishikawa Journal of Nanoscience and Nanotechnology 20 (1), 106-112, 2020 | 10 | 2020 |
| Microstructure and property changes in Cu/Sn-58Bi/Cu solder joints during thermomigration YA Shen, S Zhou, J Li, KN Tu, H Nishikawa 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2003-2008, 2019 | 5 | 2019 |
| Development of Sn-Bi-In-Ga quaternary low-temperature solders C Yang, S Zhou, S Lin, H Nishikawa 2019 International Conference on Electronics Packaging (ICEP), 367-369, 2019 | 5 | 2019 |
| Microstructure coarsening of high-temperature Sn-Pb solder joint in IGBT modules of high-speed trains SM Xue, S Zhou, X Wang, XH Zeng, ZQ Liu 2022 23rd International Conference on Electronic Packaging Technology (ICEPT …, 2022 | 4 | 2022 |
| Effects of in and Zn double addition on eutectic Sn-58Bi alloy S Zhou, YA Shen, T Uresti, V Shunmugasamy, B Mansoor, H Nishikawa 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1081-1086, 2019 | 4 | 2019 |
| The evaluation of mechanical properties of Sn58BiXTi solder by tensile test S Zhou, X Liu, O Mokhtari, H Nishikawa 2017 18th International Conference on Electronic Packaging Technology (ICEPT …, 2017 | 3 | 2017 |
| Excellent Oxidation Resistance and Solder Wettability of (111)-Oriented Nanotwinned Cu Z XU, S ZHOU, X LI, Z LIU Acta Metall Sin 60 (7), 957-967, 2024 | 1 | 2024 |
| Sintering of hollow Ag particle paste on bare Cu substrate for die attachment under a nitrogen atmosphere R Guo, S Zhou, Y Gao, ZQ Liu, R Sun 2022 23rd International Conference on Electronic Packaging Technology (ICEPT …, 2022 | 1 | 2022 |
Yu-An ShenFeng Chia UniversityVerified email at fcu.edu.tw
Chih-han YangNational Cheng Kung UniversityVerified email at mail.ncku.edu.tw
Vasanth Chakravarthy ShunmugasamyTexas A&M University at QatarVerified email at nyu.edu
Bilal MansoorTexas A&M UniversityVerified email at tamu.edu
Y C ChanCity University of Hong KongVerified email at cityu.edu.hkMuhammad Ghufran RafiqueMcGill UniversityVerified email at mail.mcgill.ca
Siliang HeGuilin University of Electronic TechnologyVerified email at guet.edu.cn
Abdulaziz AlHazaaProfessor, King Saud UniversityVerified email at ksu.edu.sa
Xiangdong LiuHuawei TechnologyVerified email at huawei.com
Omid MokhtariNoxware Ltd.
Shih-kang Lin (林士剛)National Cheng Kung UniversityVerified email at gs.ncku.edu.tw
