Requirements on information technology for product lifecycle management P Denno, T Thurman International journal of product development 2 (1-2), 109-122, 2005 | 21 | 2005 |
PWB warpage analysis and verification using an AP210 standards-based engineering framework and shadow moiré D Zwemer, M Bajaj, R Peak, T Thurman, K Brady, S McCarron, ... 5th International Conference on Thermal and Mechanical Simulation and …, 2004 | 21 | 2004 |
Towards next-generation design-for-manufacturability (DFM) frameworks for electronics product realization M Bajaj, R Peak, M Wilson, I Kim, T Thurman, MC Jothishankar, M Benda, ... IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology …, 2003 | 17 | 2003 |
7.2. 3 On enabling a model‐based systems engineering discipline P Denno, T Thurman, J Mettenburg, D Hardy INCOSE international Symposium 18 (1), 827-845, 2008 | 8 | 2008 |
Overview and Tutorial of STEP AP210, Standard for Electronic Assembly Interconnect and Packaging Design T Thurman, G Smith Sponsored by PDES, Inc, 1999 | 5 | 1999 |
Automating thermo-mechanical warpage estimation of PCBs/PCAs using a design-analysis integration framework M Bajaj, R Peak, D Zwemer, T Thurman, L Klein, G Liutkus, K Brady, ... User2User-Mentor Graphics intl. user conference, 2006 | 4 | 2006 |
An AP210-based PCA/PCB DFx analysis tool A Seth, D Mukhopadhyay, D Tang, PM Ferreira, T Thurman, J Stori 9th NASA-ESA Workshop on Product Data Exchange, 2007 | 3 | 2007 |
AP210 Edition 2 Concept of Operations KG Brady, J Stori, T Thurman Kevin G. Brady, Jamie Stori, Thomas Thurman, 2010 | 1 | 2010 |
Research Results and Recommendations for Universally Unique Identifiers in Product Data Standards TR Thurman, AG Trainer, AB Feeney, R Astheimer, M Hardwick, ... Thomas Thurman, Asa Trainer, Allison Barnard Feeney, Rosemary Astheimer …, 2024 | | 2024 |
On Migrating ISO 10303 PMI Models to a Common Core AB Feeney, AB Feeney, TR Thurman US Department of Commerce, National Institute of Standards and Technology, 2023 | | 2023 |
Recommended practice for the representation of Component catalog data in ISO 10303-210: 2014 J Stori, J Stori, TR Thurman, AB Feeney, K Brady US Department of Commerce, National Institute of Standards and Technology, 2016 | | 2016 |
Proposed recommended practice for the representation of schematic symbols in STEP AP 210 (ISO 10303-210) J Stori, J Stori, TR Thurman, C Lanning, M Benda US Department of Commerce, National Institute of Standards and Technology, 2016 | | 2016 |
Recommended practice for the representation of Component catalog data in ISO 10303-210: 2014 AB Feeney, J Stori, TR Thurman, KG Brady Allison Barnard Feeney, Jamie Stori, Thomas R. Thurman, Kevin G. Brady, 2015 | | 2015 |
On Extending an ISO Standard for Exchanging Product Manufacturing Information T Thurman, T Thurman US Department of Commerce, National Institute of Standards and Technology, 2015 | | 2015 |
ISO TC 184/SC 4 product and manufacturing information (PMI) EXPRESS models TR Thurman Thomas R. Thurman, 2014 | | 2014 |
Use Cases for the Management and Maintenance of Multi-Domain AP 210 Component Models T Thurman, J Stori, KG Brady Thomas Thurman, Jamie Stori, Kevin G. Brady, 2010 | | 2010 |
AP210 Edition 2 Concept of Operations J Stori, K Brady, R Collins, J Stori, T Thurman US Department of Commerce, National Institute of Standards and Technology, 2010 | | 2010 |
Use Cases for the Management and Maintenance of Multi-domain AP210 Component Models J Stori, K Brady, R Collins, J Stori, T Thurman US Department of Commerce, National Institute of Standards and Technology, 2010 | | 2010 |
Representation of a Thermal Resistor Network Model of a Packaged Component in STEP AP210 Edition 2 J Stori, K Brady, J Stori, T Thurman US Department of Commerce, National Institute of Standards and Technology, 2009 | | 2009 |
Extensions to the recommended practices for GD&T in STEP-AP210 in the context of packaged electronic components J Stori, K Brady, T Thurman, R Collins Jamie Stori, Kevin G. Brady, Thomas Thurman, 2009 | | 2009 |