| Inorganic light‐emitting diode displays using micro‐transfer printing RS Cok, M Meitl, R Rotzoll, G Melnik, A Fecioru, AJ Trindade, B Raymond, ... Journal of the Society for Information Display 25 (10), 589-609, 2017 | 313 | 2017 |
| III-V-on-Si photonic integrated circuits realized using micro-transfer-printing J Zhang, G Muliuk, J Juvert, S Kumari, J Goyvaerts, B Haq, C Op de Beeck, ... APL photonics 4 (11), 2019 | 187 | 2019 |
| Emissive displays with transfer-printed assemblies of 8 μm× 15 μm inorganic light-emitting diodes CA Bower, MA Meitl, B Raymond, E Radauscher, R Cok, S Bonafede, ... Photonics Research 5 (2), A23-A29, 2017 | 169 | 2017 |
| Transfer-printing-based integration of a III-V-on-silicon distributed feedback laser J Zhang, B Haq, J O’Callaghan, A Gocalinska, E Pelucchi, AJ Trindade, ... Optics express 26 (7), 8821-8830, 2018 | 143 | 2018 |
| Precision transfer printing of ultra-thin AlInGaN micron-size light-emitting diodes AJ Trindade, D Massoubre, B Guilhabert, D Zhu, N Laurand, E Gu, ... 2013 IEEE Photonics Conference, 217-218, 2013 | 123 | 2013 |
| Matrix addressed device repair RS Cok, C Bower, M Meitl, AJM Trindade US Patent 9,786,646, 2017 | 85 | 2017 |
| Heterogeneous integration of gallium nitride light-emitting diodes on diamond and silica by transfer printing AJ Trindade, G B., EY Xie, F R., JJD McKendry, Z D., E Laurand N. Gu, ... Optics Express 23 (7), 9329-9338, 2015 | 79 | 2015 |
| Nanoscale-accuracy transfer printing of ultra-thin AlInGaN light-emitting diodes onto mechanically flexible substrates CJHMDD A. J. Trindade, B. Guilhabert, D. Massoubre, D. Zhu, N. Laurand, E ... Applied Physics Letters 103, 253302, 2013 | 76 | 2013 |
| Multi-LED components C Bower, AJM Trindade, RS Cok US Patent 9,980,341, 2018 | 66 | 2018 |
| 55‐1: Invited Paper: Passive Matrix Displays with Transfer‐Printed Microscale Inorganic LEDs M Meitl, E Radauscher, S Bonafede, D Gomez, T Moore, C Prevatte, ... SID Symposium Digest of Technical Papers 47 (1), 743-746, 2016 | 63 | 2016 |
| Transfer printing of AlGaInAs/InP etched facet lasers to Si substrates R Loi, J O'Callaghan, B Roycroft, C Robert, A Fecioru, AJ Trindade, ... IEEE Photonics Journal 8 (6), 1-10, 2016 | 62 | 2016 |
| Silicon photonics fiber-to-the-home transceiver array based on transfer-printing-based integration of III-V photodetectors J Zhang, A De Groote, A Abbasi, R Loi, J O’Callaghan, B Corbett, ... Optics Express 25 (13), 14290-14299, 2017 | 59 | 2017 |
| Comparison of InGaAs and InAlAs sacrificial layers for release of InP-based devices J O’Callaghan, R Loi, EE Mura, B Roycroft, AJ Trindade, K Thomas, ... Optical Materials Express 7 (12), 4408-4414, 2017 | 46 | 2017 |
| Process capability and elastomer stamp lifetime in micro transfer printing D Gomez, K Ghosal, MA Meitl, S Bonafede, C Prevatte, T Moore, ... 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 680-687, 2016 | 43 | 2016 |
| Micro-transfer-printable flip-chip structures and methods C Bower, M Meitl, AJM Trindade, RS Cok, B Raymond, C Prevatte US Patent 10,224,231, 2019 | 38 | 2019 |
| Thermal analysis of InP lasers transfer printed to silicon photonics substrates R Loi, J O'Callaghan, B Roycroft, Z Quan, K Thomas, A Gocalinska, ... Journal of lightwave technology 36 (24), 5935-5941, 2018 | 38 | 2018 |
| Scalability and yield in elastomer stamp micro-transfer-printing D Gomez, K Ghosal, T Moore, MA Meitl, S Bonafede, C Prevatte, ... 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1779-1785, 2017 | 34 | 2017 |
| Micro-transfer-printable flip-chip structures and methods C Bower, M Meitl, AJM Trindade, RS Cok, B Raymond, C Prevatte US Patent 10,395,966, 2019 | 32 | 2019 |
| 19‐4: Invited Paper: Emissive Displays with Transfer‐Printed Microscale Inorganic LEDs MA Meitl, E Radauscher, R Rotzoll, B Raymond, S Bonafede, D Gomez, ... SID symposium digest of technical papers 48 (1), 257-263, 2017 | 28 | 2017 |
| Miniaturized LEDs for flat-panel displays EJ Radauscher, M Meitl, C Prevatte, S Bonafede, R Rotzoll, D Gomez, ... Light-Emitting Diodes: Materials, Devices, and Applications for Solid State …, 2017 | 27 | 2017 |