Yiming Huai

Yiming Huai

IEEE Fellow/CTO and VP of Technology & Foundry Partnership, Avalanche Tehcnology
Verified email at avalanche-technology.com
Cited by 21110
Zhou Peng

Zhou Peng

Fudan University
Verified email at fudan.edu.cn
Cited by 16969
Christophe Chevallier

Christophe Chevallier

Appled Materials
Verified email at amat.com
Cited by 11324
Toru Tanzawa

Toru Tanzawa

Professor, Waseda university, IEEE Fellow
Verified email at ieee.org
Cited by 9121
Sangbum Kim

Sangbum Kim

Materials Science and Engineering, Seoul National University
Verified email at snu.ac.kr
Cited by 7582
Koji Sakui

Koji Sakui

Honda Research Institute Japan
Verified email at honda-ri.jp
Cited by 7245
Pouya Hashemi

Pouya Hashemi

IBM Principal Research Scientist and Manager
Verified email at us.ibm.com
Cited by 6567
Uygar E. Avci

Uygar E. Avci

Components Research, Intel Corp.
Verified email at intel.com
Cited by 4546
Amritesh Rai

Amritesh Rai

Front End Process Integration Engineer @ Intel ▪️ UT Austin ▪️ Ohio State
Verified email at utexas.edu
Cited by 4039
Mikhail Nagoga

Mikhail Nagoga

Leman Micro Devices
Verified email at leman-micro.com
Cited by 3145
1 - 10