Ritesh Agarwal

Ritesh Agarwal

materials science and engineering, university of pennsylvania
Verified email at seas.upenn.edu
Cited by 14886
Qiang He

Qiang He

PhD. Candidate In Huazhong University of Science and Technology
Verified email at mail.hust.edu.cn
Cited by 9373
Xian-Bin Li (李贤斌)

Xian-Bin Li (李贤斌)

Professor, DEE, Jilin University (吉林大学)
Verified email at jlu.edu.cn
Cited by 4929
Nikolaos Papandreou

Nikolaos Papandreou

IBM Research - Zurich
Verified email at zurich.ibm.com
Cited by 4161
Hwang Inrok (I. Hwang)

Hwang Inrok (I. Hwang)

SK hynix (inrok.hwang@sk.com or hyperion9980@gmail.com)
Verified email at sk.com
Cited by 3425
Min Zhu (朱敏)

Min Zhu (朱敏)

Professor, Shanghai Institute of Microsystem and Information Technology
Verified email at mail.sim.ac.cn
Cited by 3325
Injo Ok

Injo Ok

NY CREATES
Verified email at sunypoly.edu
Cited by 3319
Yan Cheng

Yan Cheng

East China Normal University
Verified email at ee.ecnu.edu.cn
Cited by 3173
Huai-Yu Cheng

Huai-Yu Cheng

Senior Researcher, IBM/Macronix PCRAM Joint Project, Macronix international Co., Ltd.
Verified email at us.ibm.com
Cited by 2909
Seung Hwan Lee

Seung Hwan Lee

Intel corp.; University of Michigan - Ann Arbor; Kyung Hee University
Verified email at umich.edu
Cited by 2571
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