Douglas C.H. Yu

Douglas CH Yu

Taiwan Semiconductor Manufacturing Company Ltd.
Verified email at tsmc.com
Cited by 48158
packaging 3D microelectronics interconnect semiconductor
Rafael Auras

Rafael Auras

Professor, School of Packaging, Michigan State University
Verified email at msu.edu
Cited by 23721
polymers poly(lactic acid) packaging biodegradation life cycle assessment
joy laskar

joy laskar

georgia tech, majasystems
Verified email at majasystems.com
Cited by 17567
electrical engineering rf mmW packaging
SUBRAMANIAN S. IYER

SUBRAMANIAN S. IYER

University of California at Los Angeles,
Verified email at g.ucla.edu
Cited by 17141
Microelectronics System Integration Packaging neuromorphic computing
Madhusudan K Iyengar

Madhusudan K Iyengar

Google
Verified email at google.com
Cited by 16967
computer architecture thermal management data centers packaging energy efficiency
jone carter

jone carter

Cited by 15178
packaging
Tadatomo Suga

Tadatomo Suga

Meisei University
Verified email at gakushikai.jp
Cited by 14710
bonding packaging interface integration
L-T. Lim

LT. Lim

Department of Food Science, University of Guelph
Verified email at uoguelph.ca
Cited by 14688
film fiber packaging food electrospinning
Rick Schifferstein

Rick Schifferstein

Associate Professor TU Delft
Verified email at tudelft.nl
Cited by 13691
Food Design Eating behaviour Packaging Experience
Pierre Chandon

Pierre Chandon

L'Oréal Chaired Professor of Marketing, INSEAD
Verified email at insead.edu
Cited by 13480
marketing consumer behavior nudging food packaging
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