Profiles

Douglas CH Yu

Taiwan Semiconductor Manufacturing Company Ltd.

Verified email at tsmc.com

Cited by 48158

packaging 3D microelectronics interconnect semiconductor

Andre DeHon

University of Pennsylvania

Verified email at acm.org

Cited by 16514

Spatial Computing FPGAs Reconfigurable Interconnect Hardware Security

Daniel C. Edelstein

IBM

Verified email at us.ibm.com

Cited by 14600

Physics Optics Microelectronics Engineering Interconnect

N Singh

Brown University, Caterpillar Inc

Verified email at alumni.brown.edu

Cited by 8902

mechanics materials Interconnect packaging

Mohammad Hossein Moaiyeri

Associate Professor of Electronics and Computer Engineering, Shahid Beheshti University …

Verified email at sbu.ac.ir

Cited by 5277

Emerging Technologies Approximate Computing In-Memory Computing Interconnect

Xin-Ping Qu

Fudan university

Verified email at fudan.edu.cn

Cited by 4103

interconnect silicide ZnO nanoimprint

Professor Imed Ben Dhaou

University of Turku and Dar Al-Hekma University

Verified email at utu.fi

Cited by 2067

VLSI for DSP low-power design embedded system design for IoT approximated computing Interconnect

Arkadiy Morgenshtein

Medtronic (Given Imaging), Technion

Verified email at technion.ac.il

Cited by 1986

VLSI low-power circuits interconnect

Nick van der Meijs

Delft University of Technology

Verified email at tudelft.nl

Cited by 1889

Electrical Engineering Micro electronics Design Automation Modeling Interconnect

Neetu Prasad

Department of Electronic Science, University of Delhi South Campus

Verified email at south.du.ac.in

Cited by 1778

Graphene PLEDs Interconnect organic solar cells

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