Guangyu Sun

Guangyu Sun

School of Integrated Circuits, Peking University
Verified email at pku.edu.cn
Cited by 10960
Taehwan Moon

Taehwan Moon

Department of Intelligence Semiconductor Engineering, Ajou University
Verified email at ajou.ac.kr
Cited by 6279
Yi (Alice) Wu

Yi (Alice) Wu

Ph. D., Electrical Engineering, Stanford University
Verified email at stanford.edu
Cited by 5985
Chen Yang Yin 陈杨胤

Chen Yang Yin 陈杨胤

SanDisk
Verified email at sandisk.com
Cited by 5395
Hieu Tran

Hieu Tran

Microchip Technology
Verified email at microchip.com
Cited by 4226
Zhongwei Zhu

Zhongwei Zhu

Lam Research Corporation
Verified email at lamresearch.com
Cited by 4139
Archana Kumar

Archana Kumar

Stanford University, Applied Materials
Verified email at stanford.edu
Cited by 4010
Yih Wang

Yih Wang

Director, TSMC
Verified email at tsmc.com
Cited by 3923
YD Chih

YD Chih

TSMC
Verified email at tsmc.com
Cited by 3617
Syed M. Alam

Syed M. Alam

Everspin Technologies, Inc.
Verified email at alum.mit.edu
Cited by 3536
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