Paul Ho

Paul Ho

Professor, University of Texas at Austin
Verified email at austin.utexas.edu
Cited by 22020
C R Kao

CR Kao

Professor of Materials Science & Engineering, National Taiwan University
Verified email at ntu.edu.tw
Cited by 9367
Chih Chen

Chih Chen

National Yang Ming Chiao Tung University
Verified email at mail.nctu.edu.tw
Cited by 8470
Jungwoo Joh

Jungwoo Joh

Texas Instruments
Verified email at ti.com
Cited by 3606
Peter Elenius

Peter Elenius

Managing Partner, E&G Technology Partners
Verified email at egtechpartners.com
Cited by 1978
Choong-Un Kim

Choong-Un Kim

Professor of Materials Science and Engineering, University of Texas at Arlington
Verified email at uta.edu
Cited by 1681
Dr. Hajdin Ceric

Dr. Hajdin Ceric

Institut für Mikroelektronik, TU Wien
Verified email at iue.tuwien.ac.at
Cited by 1347
Brian E Franco

Brian E Franco

Intel Corporation
Verified email at intel.com
Cited by 878
Roberto Lacerda de Orio

Roberto Lacerda de Orio

Institute for Microelectronics, TU Wien
Verified email at iue.tuwien.ac.at
Cited by 689
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