Sungjun Park

Sungjun Park

Electrical and Computer Engineering, Ajou University
Verified email at ajou.ac.kr
Cited by 5739
Soft Electronics Device Integration
Patrik Spieß

Patrik Spieß

SAP SE
Verified email at sap.com
Cited by 3516
BPM BPMN WSN Future Energy Device Integration
Lanxia Cheng

Lanxia Cheng

Staff Engineer_EMD Electronics
Verified email at emdgroup.com
Cited by 2682
Thin Film Processing Device Integration 2D electronics DRAM/NAND PCM/OTS
Pierre Eyben

Pierre Eyben

IMEC
Verified email at imec.be
Cited by 2320
Metrology device integration FF CFET 3DDRAM
Chao Liu

Chao Liu

Shandong University; HKUST; EPFL
Verified email at sdu.edu.cn
Cited by 1778
III-Nitrides Power Electronics Device integration LED MOCVD
Dr. Casey Smith

Dr. Casey Smith

Shared Research Operations Manager, Cleanroom Director, Texas State University
Verified email at txstate.edu
Cited by 1727
Device Integration Materials Synthesis Characterization Multi-user Research Facility Management
Bryan W. K. Woo, Ph.D., E.I.T.

Bryan WK Woo, Ph.D., EIT

Google Quantum AI
Verified email at ucsd.edu
Cited by 913
Process Development Microfabrication Nanofabrication Device Integration
Quentin Diduck

Quentin Diduck

Hardware Engineer at Google
Verified email at ieee.org
Cited by 831
Device Integration Mixed Signal Design RF High Voltage HEMT
Seung Heon Shin

Seung Heon Shin

Korea Polytechnics
Verified email at kopo.ac.kr
Cited by 530
III-V compound semiconductors III-V Devices Device Integration Dry etch
Yu-Chung Lien

Yu-Chung Lien

Stanford University
Verified email at stanford.edu
Cited by 232
Solid State Electronics Nanomaterial Applications Module Processing Device Integration Simulation
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