Hsien-Hsin Sean Lee

Hsien-Hsin Sean Lee

Meta
Verified email at fb.com
Cited by 13556
Computer architecture 3DIC Data centers Sustainability ML systems
Shang Y. Hou 侯上勇

Shang Y. Hou 侯上勇

台灣積體電路有限公司
Verified email at ms9.hinet.net
Cited by 12802
Semiconductor packaging 3DIC
Yih Wang

Yih Wang

Director, TSMC
Verified email at tsmc.com
Cited by 3923
Embedded Memory Emerging Memory 3DIC Data-Centric Computing
Xiaochen Peng

Xiaochen Peng

TSMC
Verified email at tsmc.com
Cited by 3481
Neuromorphic Computing 3DIC Deep Learning Accelerator Electronic Design Automation (EDA) Circuit-Device Interaction
Quanbo Zou

Quanbo Zou

Goertek Microelectronics Inc (USA)
Cited by 2060
MEMS Sensors LEDs 3DIC CSP
Rock-Hyun Baek

Rock-Hyun Baek

POSTECH, Electrical Engineering
Verified email at postech.ac.kr
Cited by 1480
Gate-All-Around FinFET Machine Learning NAND 3DIC
Premachandran Chirayarikathuveedu (C S Premachandran)

Premachandran Chirayarikathuveedu (CS Premachandran)

GLOBALFOUNDRIES US Inc.
Verified email at globalfoundries.com
Cited by 1457
MEMS TSV CPI Packaging 3DIC
Kai-Yuan Chao

Kai-Yuan Chao

Skymizer
Verified email at skymizer.com
Cited by 1208
VLSI Design Optimization Automation 3DIC xTCO and Manufacture Interface
Rozalia Beica

Rozalia Beica

CTO at Yole Developpement
Verified email at yole.fr
Cited by 1029
Semiconductors Advanced Packaging 3DIC 3D Integrations WLP
Khaled Salah, Ph.D, MBA, SMIEEE

Khaled Salah, Ph.D, MBA, SMIEEE

Siemens
Verified email at siemens.com
Cited by 908
IoT 3DIC Machine Learning UVM SoC
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