متابعة
Philippe M. Vereecken
Philippe M. Vereecken
Fellow/Professor imec/KULeuven
بريد إلكتروني تم التحقق منه على imec.be
عنوان
عدد مرات الاقتباسات
عدد مرات الاقتباسات
السنة
Dynamic microscopy of nanoscale cluster growth at the solid–liquid interface‏
MJ Williamson, RM Tromp, PM Vereecken, R Hull, FM Ross‏
Nature materials 2 (8), 532-536, 2003‏
9122003
Chemical vapour deposition of zeolitic imidazolate framework thin films‏
I Stassen, M Styles, G Grenci, HV Gorp, W Vanderlinden, SD Feyter, ...‏
Nature materials 15 (3), 304-310, 2016‏
6742016
The chemistry of additives in damascene copper plating‏
PM Vereecken, RA Binstead, H Deligianni, PC Andricacos‏
IBM Journal of Research and Development 49 (1), 3-18, 2005‏
6022005
Quantifying electrochemical nucleation and growth of nanoscale clusters using real-time kinetic data‏
A Radisic, PM Vereecken, JB Hannon, PC Searson, FM Ross‏
Nano Letters 6 (2), 238-242, 2006‏
3132006
Liner materials for direct electrodeposition of Cu‏
MW Lane, CE Murray, FR McFeely, PM Vereecken, R Rosenberg‏
Applied physics letters 83 (12), 2330-2332, 2003‏
2342003
Electrochemical Deposition of Copper on n‐Si/TiN‏
G Oskam, PM Vereecken, PC Searson‏
Journal of The Electrochemical Society 146 (4), 1436-1441, 1999‏
1711999
Solvent-free synthesis of supported ZIF-8 films and patterns through transformation of deposited zinc oxide precursors‏
I Stassen, N Campagnol, J Fransaer, P Vereecken, D De Vos, R Ameloot‏
CrystEngComm 15 (45), 9308-9311, 2013‏
1652013
Particle codeposition in nanocomposite films‏
PM Vereecken, I Shao, PC Searson‏
Journal of the Electrochemical Society 147 (7), 2572, 2000‏
1612000
Plasma-enhanced chemical vapour deposition growth of Si nanowires with low melting point metal catalysts: an effective alternative to Au-mediated growth‏
F Iacopi, PM Vereecken, M Schaekers, M Caymax, N Moelans, ...‏
Nanotechnology 18 (50), 505307, 2007‏
1602007
The morphology and nucleation kinetics of copper islands during electrodeposition‏
A Radisic, PM Vereecken, PC Searson, FM Ross‏
Surface science 600 (9), 1817-1826, 2006‏
1572006
Measuring the electrical resistivity and contact resistance of vertical carbon nanotube bundles for application as interconnects‏
S Masahito, Y Kashiwagi, Y Li, K Arstila, O Richard, DJ Cott, M Heyns, ...‏
Nanotechnology 22 (8), 085302, 2011‏
1292011
Advances in 3D Thin‐Film Li‐Ion Batteries‏
S Moitzheim, B Put, PM Vereecken‏
Advanced Materials Interfaces, 1900805, 2019‏
1282019
Towards metal–organic framework based field effect chemical sensors: UiO-66-NH 2 for nerve agent detection‏
I Stassen, B Bueken, H Reinsch, JFM Oudenhoven, D Wouters, J Hajek, ...‏
Chemical Science, 2016‏
1272016
A USB-controlled potentiostat/galvanostat for thin-film battery characterization‏
T Dobbelaere, PM Vereecken, C Detavernier‏
HardwareX, 2017‏
1232017
Copper electrodeposition for nanofabrication of electronics devices‏
K Kondo, RN Akolkar, DP Barkey, M Yokoi‏
Springer, 2014‏
1182014
Kinetics of particle codeposition of nanocomposites‏
I Shao, PM Vereecken, RC Cammarata, PC Searson‏
Journal of the Electrochemical Society 149 (11), C610, 2002‏
1082002
Anodic etching of n-GaN epilayer into porous GaN and its photoelectrochemical properties‏
WJ Tseng, DH van Dorp, RR Lieten, PM Vereecken, G Borghs‏
The Journal of Physical Chemistry C 118 (51), 29492-29498, 2014‏
1052014
Synthesis and Characterization of Particle-reinforced Ni/Al2O3 Nanocomposites‏
I Shao, PM Vereecken, CL Chien, PC Searson, RC Cammarata‏
Journal of materials research 17 (6), 1412-1418, 2002‏
1052002
Selective capping of copper wiring‏
PC Andricacos, ST Chen, JM Cotte, H Deligianni, M Krishnan, WT Tseng, ...‏
US Patent 7,008,871, 2006‏
1042006
Solid and Solid‐Like Composite Electrolyte for Lithium Ion Batteries: Engineering the Ion Conductivity at Interfaces‏
X Chen, PM Vereecken‏
Advanced Materials Interfaces 6 (1), 1800899, 2019‏
1022019
يتعذر على النظام إجراء العملية في الوقت الحالي. عاود المحاولة لاحقًا.
مقالات 1–20