Non-volatile 3D stacking RRAM-based FPGA YC Chen, W Wang, H Li, W Zhang 22nd International conference on field programmable logic and applications …, 2012 | 62 | 2012 |
Design and experiments of a thermoelectric-powered wireless sensor network platform for smart building envelope Q Lin, YC Chen, F Chen, T DeGanyar, H Yin Applied Energy 305, 117791, 2022 | 42 | 2022 |
The 3-D stacking bipolar RRAM for high density YC Chen, H Li, W Zhang, RE Pino IEEE transactions on nanotechnology 11 (5), 948-956, 2012 | 39 | 2012 |
Design and experiment of a sun-powered smart building envelope with automatic control Q Lin, Y Zhang, A Van Mieghem, YC Chen, N Yu, Y Yang, H Yin Energy and Buildings 223, 110173, 2020 | 35 | 2020 |
A novel peripheral circuit for RRAM-based LUT YC Chen, H Li, W Zhang 2012 IEEE International Symposium on Circuits and Systems (ISCAS), 1811-1814, 2012 | 29 | 2012 |
The MTA: An advanced and versatile thermal simulator for integrated systems S Ladenheim, YC Chen, M Mihajlović, VF Pavlidis IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2018 | 23 | 2018 |
3D-HIM: A 3D high-density interleaved memory for bipolar RRAM design YC Chen, H Li, W Zhang, RE Pino 2011 IEEE/ACM International Symposium on Nanoscale Architectures, 59-64, 2011 | 18 | 2011 |
IC thermal analyzer for versatile 3-D structures using multigrid preconditioned Krylov methods S Ladenheim, YC Chen, M Mihajlović, V Pavlidis 2016 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 1-8, 2016 | 16 | 2016 |
A look up table design with 3D bipolar RRAMs YC Chen, W Zhang, H Li 17th Asia and South Pacific Design Automation Conference, 73-78, 2012 | 16 | 2012 |
3D-ICML: A 3D bipolar ReRAM design with interleaved complementary memory layers YC Chen, H Li, Y Chen, RE Pino 2011 Design, Automation & Test in Europe, 1-4, 2011 | 12 | 2011 |
STA compatible backend design flow for TSV-based 3-D ICs H Kalargaris, YC Chen, VF Pavlidis 2017 18th International Symposium on Quality Electronic Design (ISQED), 186-190, 2017 | 7 | 2017 |
Hierarchical library-based power estimator for versatile FPGAs H Liang, YC Chen, H Zhang, Wei, Li ACM/SIGDA international symposium on Field-programmable gate arrays, 2014 | 6 | 2014 |
AHEAD: Automatic holistic energy-aware design methodology for MLP neural network hardware generation in proactive BMI edge devices NS Huang, YC Chen, JC Larsen, P Manoonpong Energies 13 (9), 2180, 2020 | 5 | 2020 |
Computationally efficient standard-cell FEM-based thermal analysis YC Chen, S Ladenheim, H Kalargaris, M Mihajlović, VF Pavlidis 2017 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 490-495, 2017 | 5 | 2017 |
A hardware security scheme for RRAM-based FPGA YC Chen, W Zhang, HH Li 2013 23rd International Conference on Field programmable Logic and …, 2013 | 5 | 2013 |
Library-based placement and routing in FPGAs with support of partial reconfiguration F Mao, YC Chen, W Zhang, H Li, B He ACM Transactions on Design Automation of Electronic Systems (TODAES) 21 (4 …, 2016 | 4 | 2016 |
uBRAM-based run-time reconfigurable FPGA and corresponding reconfiguration methodology YC Chen, W Wang, W Zhang, H Li 2012 International Conference on Field-Programmable Technology, 80-86, 2012 | 4 | 2012 |
A RRAM-based Memory System and Applications YC Chen, H Li, W Zhang, RE Pino Non-volatile Memory Workshop (NVMW), 2012 | 4 | 2012 |
Thermal modeling and design exploration for monolithic 3D ICs B Peng, VF Pavlidis, YC Chen, Y Cheng 2022 23rd International Symposium on Quality Electronic Design (ISQED), 1-6, 2022 | 2 | 2022 |
BMP: a fast B*-tree based modular placer for FPGAs F Mao, YC Chen, W Zhang, H Li Proceedings of the 2014 ACM/SIGDA international symposium on Field …, 2014 | 2 | 2014 |