| Mechanisms for room temperature direct wafer bonding T Plach, K Hingerl, S Tollabimazraehno, G Hesser, V Dragoi, ... Journal of Applied Physics 113 (9), 2013 | 207 | 2013 |
| Adhesive wafer bonding for MEMS applications V Dragoi, T Glinsner, G Mittendorfer, B Wieder, P Lindner Smart Sensors, Actuators, and MEMS 5116, 160-167, 2003 | 67 | 2003 |
| Low temperature GaAs/Si direct wafer bonding M Alexe, V Dragoi, M Reiche, U Gosele Electronics letters 36 (7), 677-678, 2000 | 65 | 2000 |
| Wafer-level plasma activated bonding: new technology for MEMS fabrication V Dragoi, G Mittendorfer, C Thanner, P Lindner Microsystem Technologies 14, 509-515, 2008 | 60 | 2008 |
| CMOS: compatible wafer bonding for MEMS and wafer-level 3D integration V Dragoi, E Pabo, J Burggraf, G Mittendorfer Microsystem technologies 18, 1065-1075, 2012 | 44 | 2012 |
| Wafer-scale integration of GaAs optoelectronic devices with standard Si integrated circuits using a low-temperature bonding procedure A Georgakilas, G Deligeorgis, E Aperathitis, D Cengher, Z Hatzopoulos, ... Applied physics letters 81 (27), 5099, 2002 | 44 | 2002 |
| Cyclo-olefin polymer direct bonding using low temperature plasma activation bonding J Mizuno, H Ishida, S Farrens, V Dragoi, H Shinohara, T Suzuki, ... The 13th International Conference on Solid-State Sensors, Actuators and …, 2005 | 36 | 2005 |
| Low-temperature Cu-Cu wafer bonding B Rebhan, G Hesser, J Duchoslav, V Dragoi, M Wimplinger, K Hingerl ECS Transactions 50 (7), 139, 2013 | 35 | 2013 |
| 3D interconnect through aligned wafer level bonding P Lindner, V Dragoi, T Glinsner, C Schaefer, R Islam 52nd Electronic Components and Technology Conference 2002.(Cat. No …, 2002 | 34 | 2002 |
| Metal wafer bonding for MEMS devices V Dragoi, E Cakmak, E Pabo Romanian journal of information science and technology 13 (1), 65-72, 2010 | 33 | 2010 |
| Novel surface preparation methods for covalent and conductive bonded interfaces fabrication C Flötgen, N Razek, V Dragoi, M Wimplinger ECS Transactions 64 (5), 103, 2014 | 31 | 2014 |
| Metal thermocompression wafer bonding for 3D integration and MEMS applications V Dragoi, G Mittendorfer, J Burggraf, M Wimplinger ECS Transactions 33 (4), 27, 2010 | 31 | 2010 |
| Plasma activated wafer bonding of silicon: in situ and ex situ processes V Dragoi, P Lindner ECS transactions 3 (6), 147, 2006 | 31 | 2006 |
| Analytical methods used for low temperature Cu–Cu wafer bonding process evaluation B Rebhan, S Tollabimazraehno, G Hesser, V Dragoi Microsystem Technologies 21, 1003-1013, 2015 | 22 | 2015 |
| Advanced techniques for 3D devices in wafer-bonding processes P Lindner, V Dragoi, S Farrens, T Glinsner, P Hangweier Solid State Technology 47 (6), 55-58, 2004 | 22 | 2004 |
| New challenges for 300 mm Si technology: 3D interconnects at wafer scale by aligned wafer bonding V Dragoi, P Lindner, M Tischler, C Schaefer Materials Science in Semiconductor Processing 5 (4-5), 425-428, 2002 | 21 | 2002 |
| Wafer bonding using Cu–Sn intermetallic bonding layers C Flötgen, M Pawlak, E Pabo, HJ Van de Wiel, GR Hayes, V Dragoi Microsystem technologies 20, 653-662, 2014 | 20 | 2014 |
| Plasma activation for low temperature wafer bonding T Plach, V Dragoi, F Murauer, K Hingerl ECS Transactions 16 (8), 549, 2008 | 17 | 2008 |
| Low temperature MEMS manufacturing processes: plasma activated wafer bonding V Dragoi, S Farrens MRS Online Proceedings Library (OPL) 872, J7. 1, 2005 | 17 | 2005 |
| Cu-Cu wafer bonding: An enabling technology for three-dimensional integration B Rebhan, T Plach, S Tollabimazraehno, V Dragoi, M Kawano 2014 International Conference on Electronics Packaging (ICEP), 475-479, 2014 | 16 | 2014 |
