| Embedded cooling with 3D manifold for vehicle power electronics application: Single-phase thermal-fluid performance KW Jung, CR Kharangate, H Lee, J Palko, F Zhou, M Asheghi, EM Dede, ... International Journal of Heat and Mass Transfer 130, 1108-1119, 2019 | 150 | 2019 |
| A machine learning approach for predicting heat transfer characteristics in micro-pin fin heat sinks K Kim, H Lee, M Kang, G Lee, K Jung, CR Kharangate, M Asheghi, ... International Journal of Heat and Mass Transfer 194, 123087, 2022 | 68 | 2022 |
| Characterization and thermal modeling of a miniature silicon vapor chamber for die-level heat redistribution T Liu, MT Dunham, KW Jung, B Chen, M Asheghi, KE Goodson International Journal of Heat and Mass Transfer 152, 119569, 2020 | 59 | 2020 |
| Microchannel cooling strategies for high heat flux (1 kW/cm2) power electronic applications KW Jung, CR Kharangate, H Lee, J Palko, F Zhou, M Asheghi, EM Dede, ... 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2017 | 54 | 2017 |
| Single-phase thermal and hydraulic performance of embedded silicon micro-pin fin heat sinks using R245fa D Kong, KW Jung, S Jung, D Jung, J Schaadt, M Iyengar, C Malone, ... International Journal of Heat and Mass Transfer 141, 145-155, 2019 | 51 | 2019 |
| An artificial neural network model for predicting frictional pressure drop in micro-pin fin heat sink H Lee, M Kang, KW Jung, CR Kharangate, S Lee, M Iyengar, C Malone, ... Applied Thermal Engineering 194, 117012, 2021 | 48 | 2021 |
| High heat flux two-phase cooling of electronics with integrated diamond/porous copper heat sinks and microfluidic coolant supply JW Palko, H Lee, DD Agonafer, C Zhang, KW Jung, J Moss, JD Wilbur, ... 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 48 | 2016 |
| Thermal design and management of micro-pin fin heat sinks for energy-efficient three-dimensional stacked integrated circuits D Jung, H Lee, D Kong, E Cho, KW Jung, CR Kharangate, M Iyengar, ... International Journal of Heat and Mass Transfer 175, 121192, 2021 | 39 | 2021 |
| Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux … KW Jung, S Hazra, H Kwon, A Piazza, E Jih, M Asheghi, MP Gupta, ... Journal of Electronic Packaging 142 (3), 031118, 2020 | 38* | 2020 |
| Porous micropillar structures for retaining low surface tension liquids DD Agonafer, H Lee, PA Vasquez, Y Won, KW Jung, S Lingamneni, B Ma, ... Journal of colloid and interface science 514, 316-327, 2018 | 34 | 2018 |
| Experimental investigation of embedded micropin-fins for single-phase heat transfer and pressure drop CR Kharangate, K Wook Jung, S Jung, D Kong, J Schaadt, M Iyengar, ... Journal of Electronic Packaging 140 (2), 021001, 2018 | 24 | 2018 |
| Busbar design for distributed DC-link capacitor banks for traction applications R Alizadeh, M Schupbach, T Adamson, JC Balda, Y Zhao, S Long, ... 2018 IEEE Energy Conversion Congress and Exposition (ECCE), 4810-4815, 2018 | 23 | 2018 |
| Application of convolutional neural network to predict anisotropic effective thermal conductivity of semiconductor package TH Kim, JH Park, KW Jung, J Kim, EH Lee IEEE Access 10, 51995-52007, 2022 | 17 | 2022 |
| Considerations and challenges for large area embedded micro-channels with 3D manifold in high heat flux power electronics applications A Piazza, S Hazra, KW Jung, M Degner, MP Gupta, E Jih, M Asheghi, ... 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 14 | 2020 |
| Experimental study of single-phase cooling with DI water in an embedded microchannels-3D manifold cooler KW Jung, F Zhou, M Asheghi, EM Dede, KE Goodson 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), 164-166, 2019 | 9 | 2019 |
| Investigating Thermo-Fluidic Performance of Si-Based Embedded Microchannels-3D Manifold Cooling System for High Power Density Electronic Applications KW Jung Stanford University, 2020 | 7 | 2020 |
| Microfabrication Challenges for Silicon-based Large Area (>500 mm2) 3D-manifolded Embedded Microcooler Devices for High Heat Flux Removal S Hazra, A Piazza, KW Jung, M Asheghi, MP Gupta, E Jih, M Degner, ... 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 5 | 2020 |
| Chip-scale cooling of power semiconductor devices: Fabrication of Jet impingement design F Zhou, KW Jung, Y Fukuoka, EM Dede 2018 IEEE 30th International Symposium on Power Semiconductor Devices and …, 2018 | 5 | 2018 |
| Mechanical Design and Reliability of Gold-Tin Eutectic Bonding for Silicon-Based Thermal Management Devices F Soroush, KW Jung, M Iyengar, C Malone, M Asheghi, K Goodson 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 4 | 2020 |
| Thermal Management Research–from Power Electronics to Portables KW Jung, C Zhang, T Liu, M Asheghi, KE Goodson 2018 IEEE Symposium on VLSI Technology, 17-18, 2018 | 4 | 2018 |
Kenneth E. GoodsonStanford Mechanical Engineering, Davies Provostial Professorبريد إلكتروني تم التحقق منه على stanford.edu