مقالات بحثية تمّ التفويض بإتاحتها للجميع - Vasilis F. Pavlidisمزيد من المعلومات
عدد المقالات البحثية غير المتاحة للجميع في أي موقع: 8
Energy-Efficient Time-Based Adaptive Encoding for Off-Chip Communication
E Maragkoudaki, VF Pavlidis
IEEE Transactions on Very Large Scale Integration (VLSI) Systems 28 (12 …, 2020
التفويضات: European Commission
Fabrication Cost Analysis for Contactless 3-D ICs
IA Papistas, VF Pavlidis, D Velenis
IEEE Transactions on Circuits and Systems II: Express Briefs 66 (5), 758-762, 2019
التفويضات: UK Engineering and Physical Sciences Research Council
Energy-Efficient Encoding for High-Speed Serial Interfaces
E Maragkoudaki, W Toms, VF Pavlidis
IEEE Transactions on Very Large Scale Integration (VLSI) Systems 30 (10 …, 2022
التفويضات: European Commission
Two Stage Diode-String Architecture for Ultra-Low Power Digital to Analog Converters
A Tsiougkos, M Antoniadis, VF Pavlidis
2024 20th International Conference on Synthesis, Modeling, Analysis and …, 2024
التفويضات: European Commission
Ternary Clock Tree Synthesis for 3D ICs
C Pavlidis, N Sketopoulos, CP Sotiriou, VF Pavlidis
2024 20th International Conference on Synthesis, Modeling, Analysis and …, 2024
التفويضات: European Commission
Integrating Low Power Data Encoding in Intel Advanced Interface Bus
E Kotoulas, VF Pavlidis
2024 Panhellenic Conference on Electronics & Telecommunications (PACET), 1-4, 2024
التفويضات: European Commission
Word-Oriented Memory Test and Coupling Fault Coverage: a RAW and RAW1 Case Study
MR Saridakis, G Pouiklis, VF Pavlidis
2024 Panhellenic Conference on Electronics & Telecommunications (PACET), 1-4, 2024
التفويضات: European Commission
Comparative study of crosstalk noise due to inductive links on heterogeneous 3-D ICs
IA Papistas, VF Pavlidis
2017 IEEE MTT-S International Conference on Numerical Electromagnetic and …, 2017
التفويضات: UK Engineering and Physical Sciences Research Council
عدد المقالات البحثية المتاحة للجميع في موقع ما: 40
Miniaturized SIW Bandpass Filter Based on TSV Technology for THz Applications
F Wang, VF Pavlidis, N Yu
IEEE Transactions on Terahertz Science and Technology, 2020
التفويضات: National Natural Science Foundation of China
Analytical heat transfer model for thermal through-silicon vias
H Xu, VF Pavlidis, G De Micheli
Design, Automation & Test in Europe Conference & Exhibition (DATE), 2011, 1-6, 2011
التفويضات: Swiss National Science Foundation
Monolithic 3D Integrated Circuits: Recent Trends and Future Prospects
K Dhananjay, P Shukla, VF Pavlidis, A Coskun, E Salman
IEEE Transactions on Circuits and Systems II: Express Briefs 68 (3), 837-843, 2021
التفويضات: US National Science Foundation
An Overview of Thermal Challenges and Opportunities for Monolithic 3D ICs
P Shukla, AK Coskun, VF Pavlidis, E Salman
Proceedings of the 2019 on Great Lakes Symposium on VLSI, 439-444, 2019
التفويضات: US National Science Foundation
Effect of process variations in 3D global clock distribution networks
H Xu, VF Pavlidis, G De Micheli
ACM Journal on Emerging Technologies in Computing Systems (JETC) 8 (3), 20, 2012
التفويضات: Swiss National Science Foundation
The MTA: An Advanced and Versatile Thermal Simulator for Integrated Systems
S Ladenheim, YC Chen, M Mihajlović, VF Pavlidis
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2018
التفويضات: UK Engineering and Physical Sciences Research Council
The combined effect of process variations and power supply noise on clock skew and jitter
H Xu, VF Pavlidis, W Burleson, G De Micheli
Quality Electronic Design (ISQED), 2012 13th International Symposium on, 320-327, 2012
التفويضات: Swiss National Science Foundation
Energy Efficient Flash ADC with PVT Variability Compensation through Advanced Body Biasing
P Mroszczyk, J Goodacre, VF Pavlidis
IEEE Transactions on Circuits and Systems II: Express Briefs, 2019
التفويضات: European Commission
Bandwidth-to-area comparison of through silicon vias and inductive links for 3-D ICs
IA Papistas, VF Pavlidis
2015 European Conference on Circuit Theory and Design (ECCTD), 1-4, 2015
التفويضات: UK Engineering and Physical Sciences Research Council
IC thermal analyzer for versatile 3-D structures using multigrid preconditioned Krylov methods
S Ladenheim, YC Chen, M Mihajlović, V Pavlidis
Computer-Aided Design (ICCAD), 2016 IEEE/ACM International Conference on, 1-8, 2016
التفويضات: UK Engineering and Physical Sciences Research Council
Timing Uncertainty in 3-D Clock Trees Due to Process Variations and Power Supply Noise
H Xu, VF Pavlidis, X Tang, W Burleson, G De Micheli
IEEE Transactions on Very Large Scale Integration (VLSI) Systems 21 (12 …, 2013
التفويضات: Swiss National Science Foundation, European Commission
Process-induced skew variation for scaled 2-D and 3-D ICs
H Xu, VF Pavlidis, G De Micheli
Proceedings of the 12th ACM/IEEE international workshop on System level …, 2010
التفويضات: Swiss National Science Foundation
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