متابعة
Vasilis F. Pavlidis
Vasilis F. Pavlidis
Computer Science and University of Manchester
بريد إلكتروني تم التحقق منه على cs.man.ac.uk - الصفحة الرئيسية
عنوان
عدد مرات الاقتباسات
عدد مرات الاقتباسات
السنة
3-D topologies for networks-on-chip‏
VF Pavlidis, EG Friedman‏
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on 15 (10 …, 2007‏
6002007
Three-dimensional integrated circuit design‏
VF Pavlidis, EG Friedman‏
Morgan Kaufmann Pub, 2009‏
490*2009
Three-dimensional integrated circuits‏
VF Pavlidis, EG Friedman‏
Burlington, MA: Morgan Kaufmann, 2009‏
489*2009
Performance analysis of 3-D monolithic integrated circuits‏
S Bobba, A Chakraborty, O Thomas, P Batude, VF Pavlidis, G De Micheli‏
2010 IEEE International 3D Systems Integration Conference (3DIC), 1-4, 2010‏
2632010
Interconnect-based design methodologies for three-dimensional integrated circuits‏
VF Pavlidis, EG Friedman‏
Proceedings of the IEEE 97 (1), 123-140, 2009‏
1562009
Clock distribution networks for 3-D integrated Circuits‏
VF Pavlidis, I Savidis, EG Friedman‏
Custom Integrated Circuits Conference, 2008. CICC 2008. IEEE, 651-654, 2008‏
792008
Clock distribution networks in 3-D integrated systems‏
VF Pavlidis, I Savidis, EG Friedman‏
IEEE Transactions on very large scale integration (VLSI) systems 19 (12 …, 2011‏
642011
Miniaturized SIW Bandpass Filter Based on TSV Technology for THz Applications‏
F Wang, VF Pavlidis, N Yu‏
IEEE Transactions on Terahertz Science and Technology, 2020‏
542020
Analytical heat transfer model for thermal through-silicon vias‏
H Xu, VF Pavlidis, G De Micheli‏
Design, Automation & Test in Europe Conference & Exhibition (DATE), 2011, 1-6, 2011‏
542011
Monolithic 3D Integrated Circuits: Recent Trends and Future Prospects‏
K Dhananjay, P Shukla, VF Pavlidis, A Coskun, E Salman‏
IEEE Transactions on Circuits and Systems II: Express Briefs 68 (3), 837-843, 2021‏
452021
Nanoscale Room-Temperature Multilayer Skyrmionic Synapse for Deep Spiking Neural Networks‏
R Chen, C Li, Y Li, JJ Miles, G Indiveri, S Furber, VF Pavlidis, C Moutafis‏
Physical Review Applied 14 (1), 014096, 2020‏
382020
Interconnect delay minimization through interlayer via placement in 3-D ICs‏
VF Pavlidis, EG Friedman‏
Proceedings of the 15th ACM Great Lakes symposium on VLSI, 20-25, 2005‏
382005
An Overview of Thermal Challenges and Opportunities for Monolithic 3D ICs‏
P Shukla, AK Coskun, VF Pavlidis, E Salman‏
Proceedings of the 2019 on Great Lakes Symposium on VLSI, 439-444, 2019‏
372019
A novel framework for exploring 3-D FPGAs with heterogeneous interconnect fabric‏
K Siozios, VF Pavlidis, D Soudris‏
ACM Transactions on Reconfigurable Technology and Systems (TRETS) 5 (1), 4, 2012‏
302012
Emerging monolithic 3D integration: Opportunities and challenges from the computer system perspective‏
Y Cheng, X Guo, VF Pavlidis‏
Integration 85, 97-107, 2022‏
292022
Power distribution paths in 3-D ICS‏
VF Pavlidis, G De Micheli‏
Proceedings of the 19th ACM Great Lakes symposium on VLSI, 263-268, 2009‏
272009
Skyrmionic interconnect device‏
R Chen, Y Li, VF Pavlidis, C Moutafis‏
Physical Review Research 2 (4), 043312, 2020‏
242020
Effect of process variations in 3D global clock distribution networks‏
H Xu, VF Pavlidis, G De Micheli‏
ACM Journal on Emerging Technologies in Computing Systems (JETC) 8 (3), 20, 2012‏
242012
The MTA: An Advanced and Versatile Thermal Simulator for Integrated Systems‏
S Ladenheim, YC Chen, M Mihajlović, VF Pavlidis‏
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2018‏
232018
A software-supported methodology for designing high-performance 3D FPGA architectures‏
K Siozios, K Sotiriadis, VF Pavlidis, D Soudris‏
2007 IFIP International Conference on Very Large Scale Integration, 54-59, 2007‏
202007
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مقالات 1–20